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  ? semiconductor components industries, llc, 2014 march, 2014 ? rev. 12 1 publication order number: mc74hc1g14/d mc74hc1g14 single inverter with schmitt-trigger input the mc74hc1g14 is a high speed cmos inverter with schmitt ? trigger input fabricated with silicon gate cmos technology. the internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. the mc74hc1g14 output drive current is 1/2 compared to mc74hc series. ? high speed: t pd = 7.0 ns (typ) at v cc = 5.0 v ? low power dissipation: i cc = 1.0  a (max) at t a = 25  c ? high noise immunity ? balanced propagation delays (t plh = t phl ) ? symmetrical output impedance (i oh = i ol = 2.0 ma) ? chip complexity: fet = 101 ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable ? these devices are pb ? free and are rohs compliant figure 1. pinout (top view) v cc nc in a out y gnd figure 2. logic symbol in a out y 1 1 2 3 4 5 see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information pin assignment 1 2 3 gnd nc in a 4 5v cc out y l h function table inputs outputs h l http://onsemi.com marking diagrams ha = device code m = date code*  = pb ? free package sc ? 88a / sot ? 353 / sc ? 70 df suffix case 419a tsop ? 5 / sot ? 23 / sc ? 59 dt suffix case 483 ha m   1 5 ha m   m 1 5 (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location.
mc74hc1g14 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage  0.5 to  7.0 v v in dc input voltage  0.5 to v cc  0.5 v v out dc output voltage  0.5 to v cc  0.5 v i ik dc input diode current  20 ma i ok dc output diode current  20 ma i out dc output sink current  12.5 ma i cc dc supply current per supply pin  25 ma t stg storage temperature range  65 to  150  c t l lead temperature, 1 mm from case for 10 seconds 260  c t j junction temperature under bias  150  c  ja thermal resistance sc70 ? 5/sc ? 88a/sot ? 353 (note 1) sot23 ? 5/tsop ? 5/sc59 ? 5 350 230  c/w p d power dissipation in still air at 85  csc70 ? 5/sc ? 88a/sot ? 353 sot23 ? 5/tsop ? 5/sc59 ? 5 150 200 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4)  2000  200 n/a v i latchup latchup performance above v cc and below gnd at 125  c (note 5)  500 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace with no air flow. 2. tested to eia/jesd22 ? a114 ? a. 3. tested to eia/jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc dc supply voltage 2.0 6.0 v v in dc input voltage 0.0 v cc v v out dc output voltage 0.0 v cc v t a operating temperature range  55  125  c t r , t f input rise and fall time v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v ? ? no limit no limit ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature normalized failure rate time, years t j = 130  c t j = 120  c t j = 110  c t j = 100  c t j = 90  c t j = 80  c
mc74hc1g14 http://onsemi.com 3 dc electrical characteristics v cc t a = 25  c t a  85  c  55  c  t a  125  c symbol parameter test conditions (v) min typ max min max min max unit v t+ positive threshold voltage 3.0 4.5 5.5 1.85 2.86 3.50 2.0 3.0 3.6 2.20 3.15 3.85 2.20 3.15 3.85 2.20 3.15 3.85 v v t ? negative threshold voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 1.65 2.46 3.05 0.9 1.35 1.65 0.9 1.35 1.65 v v h hysteresis voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.57 0.67 0.74 1.20 1.40 1.60 0.30 0.40 0.50 1.20 1.40 1.60 0.30 0.40 0.50 1.20 1.40 1.60 v v oh minimum high ? level output voltage v in = v ih or v il i oh = ? 20  a 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 1.9 2.9 4.4 5.9 v v in  v t  min i oh =  2 ma i oh =  2.6 ma 4.5 6.0 4.18 5.68 4.31 5.80 4.13 5.63 4.08 5.58 v ol maximum low ? level output voltage v in v t  max i ol = 20  a 2.0 3.0 4.5 6.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 2 ma i ol = 2.6 ma 4.5 6.0 0.17 0.18 0.26 0.26 0.33 0.33 0.40 0.40 i in maximum input leakage current v in = 6.0 v or gnd 6.0  0.1  1.0  1.0  a i cc maximum quiescent supply current v in = v cc or gnd 6.0 1.0 10 40  a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. ac electrical characteristics (input t r = t f = 6.0 ns) t a = 25  c t a  85  c  55  c  t a  125  c symbol parameter test conditions min typ max min max min max unit ???? ???? ???? ???? t plh , t phl ?????? ?????? ?????? ?????? ???????? ???????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ?? ?? ???????? ???????? ???????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? ?? ?? ?? ???? ???? ???? ???? ???? ?????? ?????? ?????? ?????? ?????? ???????? ???????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ?? ?? ???????? ???????? ???????? ???????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? ???? ???? ?? ?? ?? ?? ???? ???? ???? ?????? ?????? ?????? ???????? ???????? ???????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ???? ?? ?? ?? typical @ 25  c, v cc = 5.0 v c pd power dissipation capacitance (note 6) 10 pf 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd  v cc  f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd  v cc 2  f in + i cc  v cc .
mc74hc1g14 http://onsemi.com 4 *includes all probe and jig capacitance. a 1 ? mhz square input wave is recommended for propagation delay tests. figure 4. switching waveforms figure 5. test circuit c l* input output v cc gnd 50% 50% input a output y t phl t plh 90% 10% 90% 10% t tlh t thl t r t f ordering information device package shipping ? mc74hc1g14dft1g sc70 ? 5/sc ? 88a/sot ? 353 (pb ? free) 3000 / tape & reel nlvhc1g14dft1g* mc74hc1g14dft2g NLVHC1G14DFT2G* mc74hc1g14dtt1g sot23 ? 5/tsop ? 5/sc59 ? 5 (pb ? free) nlv74hc1g14dtt1g* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable.
mc74hc1g14 http://onsemi.com 5 package dimensions sc ? 88a (sc ? 70 ? 5/sot ? 353) case 419a ? 02 issue l notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ?  mm inches  scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint
mc74hc1g14 http://onsemi.com 6 package dimensions tsop ? 5 case 483 ? 02 issue k 0.7 0.028 1.0 0.039  mm inches  scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j  0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc74hc1g14/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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